cExpress-AL COM Express® Modules

ADLINK Technology cExpress-AL COM Express® Modules are Type-6 modules that are designed for optimal processing and graphics performance with low power consumption. These modules support IEEE 1588 Precision Time Protocol (PTP) and provide non-ECC type DDR3L dual-channel memory for excellent overall performance. The cExpress-AL modules are equipped with SPI AMI EFI BIOS that supports embedded features such as a remote console, CMOS backup, hardware monitor, and watchdog timer. These compact size modules operate at -40°C to 85°C  temperature range and are available in a 95mm x 95mm dimension.

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Description Datasheet Availability Pricing (SGD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
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Type
ADLINK Technology Heat Sinks HTS-cAL-B-IHeatspreader for cExpress-AL (APL-I) with threaded standoffs for bottom mounting Non-Stocked
Min.: 1
Mult.: 1

Heat Spreaders cExpress-AL Atom
ADLINK Technology Heat Sinks HTS-cAL-BT-IHeatspreader for cExpress-AL (APL-I) with through hole standoffs for top mounting Non-Stocked
Min.: 1
Mult.: 1

Heat Spreaders cExpress-AL Atom Top Mount
ADLINK Technology Heat Sinks THS-cAL-B-ILow profile heatsink for cExpress-AL (APL-I) with threaded standoffs for bottom mounting Non-Stocked
Min.: 1
Mult.: 1

Heat Sinks cExpress-AL Atom Bottom Mounting
ADLINK Technology Heat Sinks THSF-cAL-B-IHigh profile heatsink with Fan for cExpress-AL (APL-I) with threaded standoffs for bottom mounting Non-Stocked
Min.: 1
Mult.: 1

Fan Sink Assemblies cExpress-AL Atom Active Cooler
ADLINK Technology Heat Sinks THSH-cAL-BHigh profile heatsink for cExpress-AL (APL) with threaded standoffs for bottom mounting Non-Stocked
Min.: 1
Mult.: 1

Heat Sinks nanoX-AL Pentium/Celeron Bottom Mounting
ADLINK Technology Heat Sinks THSH-cAL-B-IHigh profile heatsink for cExpress-AL (APL-I) with threaded standoffs for bottom mounting Non-Stocked
Min.: 1
Mult.: 1

Heat Sinks nanoX-AL Atom Bottom Mounting