eMMC

Results: 608
Select Image Part # Mfr. Description Datasheet Availability Pricing (SGD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Package/Case Memory Size Configuration Sequential Read Sequential Write Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Packaging
ATP Electronics eMMC Industrial Temp. -40C to +85C 11.5x13 MLC eMMC Non-Stocked Lead-Time 40 Weeks
Min.: 760
Mult.: 760

E600Si FBGA-153 MLC - 40 C + 85 C Tray
Alliance Memory eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel Non-Stocked Lead-Time 16 Weeks
Min.: 1,500
Mult.: 1,500
Reel: 1,500
FBGA-153 32 GB TLC 270 MB/s 120 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 85 C Reel
Alliance Memory ASFC10G31P3-51BINTR
Alliance Memory eMMC 10GB, pSLC eMMC 5.1, 3V, Gen3 TLC NAND, Industrial Grade, 153ball FBGA Package 11.5x13mm) T&R Non-Stocked Lead-Time 12 Weeks
Min.: 1,500
Mult.: 1,500
Reel: 1,500

FBGA-153 10 GB 3D TLC 280 MB/s 120 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 85 C Reel
Alliance Memory ASFC5G31P3-51BINTR
Alliance Memory eMMC 5GB, pSLC eMMC 5.1, 3V, Gen3 TLC NAND, Industrial Grade, 153ball FBGA Package 11.5x13mm) T&R Non-Stocked Lead-Time 12 Weeks
Min.: 1,500
Mult.: 1,500
Reel: 1,500

FBGA-153 5 GB 3D TLC 270 MB/s 120 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 85 C Reel
ATP Electronics FA4G00EMCV3RBFE
ATP Electronics eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760

FBGA-153
ATP Electronics FA8G00EMCV3RBFE
ATP Electronics eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760

FBGA-153
ATP Electronics FM16G0EMCV3RBFE
ATP Electronics eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760

FBGA-153
ATP Electronics FM8G00EMCV3RBFE
ATP Electronics eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC Non-Stocked Lead-Time 29 Weeks
Min.: 760
Mult.: 760

FBGA-153