W66BP6NB/W66CP2NQ SDRAM LPDDR4

Winbond W66BP6NB/W66CP2NQ SDRAM LPDDR4 offers a Single-Die-Package (SDP) or Dual-Die-Package (DDP) and a 2 or 4 clocks architecture on the Command/Address (CA) bus. The LPDDR4 utilizes the 2 or 4 clocks architecture on the CA bus to reduce the number of input pins in the system. The 6-bit CA bus contains the command, address, and bank information. Each command uses a 1, 2, or 4 clock cycle, during which command information is transferred on the positive edge of the clock.

Results: 2
Select Image Part # Mfr. Description Datasheet Availability Pricing (SGD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Memory Size Data Bus Width Maximum Clock Frequency Package/Case Organisation Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Packaging
Winbond DRAM 4Gb LPDDR4X, DDP, x32, 1600MHz, -40C-105C 130In Stock
Min.: 1
Mult.: 1
Max.: 130

SDRAM - LPDDR4X 4 Gbit 32 bit 1.6 GHz WFBGA-200 128 M x 32 1.06 V 1.95 V - 40 C + 105 C Tray
Winbond DRAM 2Gb LPDDR4X, x16, 1600MHz, -40C-105C 63In Stock
Min.: 1
Mult.: 1
Max.: 63

SDRAM - LPDDR4X 2 Gbit 16 bit 1.6 GHz WFBGA-200 128 M x 16 1.06 V 1.95 V - 40 C + 105 C Tray