Nextreme HV Series Thermoelectric Coolers

Nextreme HV Series Thermoelectric Coolers

Nextreme HV Series Thermoelectric Coolers are part of a new line of thin-film, high voltage and high heat pumping thermoelectric coolers (TECs) that are designed for the cooling and temperature control of photonics and optoelectronic devices. Nextreme has developed the HV Series Thermoelectric Coolers to address electronics cooling applications with high heat flux and larger heat pumping requirements. The HV Series removes unique voltage and current requirements as barriers to the integration of thin-film thermoelectrics into electronics.

The size, input power requirements, and heat pumping capability of the OptoCooler™ HV14 make it particularly well suited for devices such as laser diodes and high brightness LEDs.

The OptoCooler™ HV37 can be integrated directly into electronic packaging to deliver cooling for a wide variety of thermal management applications. It is ideally suited for devices such as semiconductor optical amplifiers (SOA), laser diodes, LEDs, VCSELs, and photo-detectors. The HV37 operates with heat fluxes more than 10 times greater than conventional thermoelectric coolers. It is designed to withstand AuSn assembly processes.

The eTEC™ HV56 is manufactured using gold-tin (AuSn) solder, which enables assembly temperatures as high as 320°C. These assembly temperatures make the HV56 compatible with industry standard processes for packaging electronic devices that require tight tolerances.

The Nextreme HV Series' extremely small footprint opens up new thermal management capabilities in electronics that were previously unavailable. Each of these models is RoHS compliant.

OptoCooler™ HV14 Specifications
  • 1.7 watts maximum cooling
  • 115 W/cm2 heat pumping capability
  • Super small 1.52mm X 1.79mm footprint
  • Extremely thin 0.57mm profile
  • <2ms response time
OptoCooler™ HV37 Specifications
  • 3.7 watts maximum cooling at 25°C
  • 50K ΔT max at 25°C
  • 107W/cm2 heat pumping capability
  • Small 2.1mm X 2.9mm footprint
  • Extremely thin 0.6mm profile
  • Au surfaces on top and bottom headers
eTEC™ HV56 Specifications
  • 6 watts maximum cooling
  • 58W/cm2 heat pumping capability
  • Small 3.1mm X 3.3mm footprint
  • Extremely thin 0.56mm profile
  • Au surfaces on top and bottom headers
HV14 Dimensions

HV14 Dimensions

HV56 Dimensions

HV56 Dimensions
  • Nextreme Thermal Solutions
  • Embedded Solutions|Thermal Management