Ka-Ro Electronics QSMP2 Solder-Down Computer On Modules
Ka-Ro Electronics QSMP2 Solder-Down Computer On Modules come with a dual Arm® Cortex®-A35 and 1.5GHz Arm® Cortex®-M33 STM32MP255 processor. These modules feature single-sided assembly, up to 60x 3.3V general purpose I/O, 4GB eMMC ROM, 1GB LPDDR4 RAM, and an LVDS display interface. The QSMP2 modules come in 2.6mm height and support Linux OS. These modules are industrial-grade and are pin-compatible with the QS family. The QSMP2 modules are easy to use and are used in designing and testing basic computing nodes and corresponding OS.
Features
- Dual Arm® Cortex®-A35 and 1.5GHz Arm® Cortex®-M33 STM32MP255 processor, 400MHz
- 4GB eMMC ROM
- 1GB LPDDR4 RAM
- Industrial-grade
- -40°C to 85°C temperature range
- 2.6mm height and 29mm square
- QS family pin-compatible
- Visual solder joint inspection
- Supports Linux OS
- QFN type lead style:
- 1mm pitch
- 108 pads
- Thermal pad
- Display:
- LVDS display interface
- 3D GPU: OpenGL® ES 3.1 - Vulkan 1.1, OpenCL™ 1.2, OpenVX™ 1.1, up to 149Mtriangle/s, and 900Mpixel/s
- VPU: H264/VP8 up to FHD (1920x1080) @60fps
- Connectivity:
- 2x USB 2.0 + PCIe or 1x USB 2.0 + 1x USB 3.0
- 2x Gb Ethernet, RGMII
- 1x eMMC/SD
- 3x FlexCAN
- 3x UART, 3x I2C, 2x SPI, PWM, and SAI
- Up to 60x 3.3V general purpose I/O
- MIPI-CSI (2-lane)
Applications
- Designing and testing basic computing nodes and corresponding OS
Related Module
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Evaluation Kit
Ka-Ro Electronics QSBASE5 Evaluation Kit
Feature dual 10/100 Ethernet, LVDS display connector, and MIPI camera connector.
Published: 2025-03-11
| Updated: 2025-04-24