+ 85 C Multiprotocol Modules

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Description Datasheet Availability Pricing (SGD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Qualification
Packaging
Murata Electronics Multiprotocol Modules Type 1ZM Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.1
Datasheet
2,000Expected 21/1/2027
Min.: 1
Mult.: 1
: 1,000

1ZM 2.4 GHz, 5 GHz 17 dBm SDIO, UART 1.62 V 1.92 V - 30 C + 85 C u.FL 10.2 mm x 9.3 mm x 1.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Reel, Cut Tape
Murata Electronics Multiprotocol Modules BT 5.4/WIFI 6
Datasheet
1,000Expected 20/8/2026
Min.: 1
Mult.: 1
: 1,000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Murata Electronics Multiprotocol Modules Type 2FY Infineon CYW55513 ShieldedSmall WiFi 11a/b/g/n/ac/ax SISO+BT 5.4 Module
Datasheet
958Expected 12/8/2026
Min.: 1
Mult.: 1
: 1,000

2FY 2.4 GHz, 5 GHz, 6 GHz GPIO, UART 3 V 4.8 V - 40 C + 85 C 7.9 mm x 7.3 mm x 1.1 mm Bluetooth WiFi - 802.11 Reel, Cut Tape
Murata Electronics Multiprotocol Modules Type 2FR module
Datasheet
975Expected 18/8/2026
Min.: 1
Mult.: 1
: 1,000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape
Murata Electronics Multiprotocol Modules RF TXRX MODULE 5.4/WIFI 6
Datasheet
1,000Expected 22/12/2026
Min.: 1
Mult.: 1
: 1,000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape

Murata Electronics Multiprotocol Modules Type 2BP NXP SR150 UWB MODULE
Datasheet
999Expected 23/9/2026
Min.: 1
Mult.: 1
: 1,000

UWB 6.25 GHz to 8.25 GHz SPI - 30 C + 85 C 6.6 mm x 5.8 mm x 1.2 mm Reel, Cut Tape
Quectel Multiprotocol Modules
100On Order
Min.: 1
Mult.: 1
- 40 C + 85 C 16.6 mm x 13 mm x 2.05 mm Bluetooth, BLE
Quectel Multiprotocol Modules 2.4 GHz + 5 GHz + 6 GHz,Triple-band Wi-Fi 7, BT6.0 dual-mode
Datasheet
100On Order
Min.: 1
Mult.: 1
: 250
2.4 GHz, 5 GHz, 6 GHz 3 V 3.6 V - 30 C + 85 C 15 mm × 13 mm × 1.8 mm Bluetooth WiFi Reel, Cut Tape
Murata Electronics Multiprotocol Modules Type 1XK Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.2
Datasheet
972Expected 24/12/2026
Min.: 1
Mult.: 1
: 500

1XK 2.4 GHz, 5 GHz UART 2.7 V 5.5 V - 40 C + 85 C u.FL 9.1 mm x 8.3 mm x 1.3 mm Bluetooth 5.2 Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: LCC(ANT_WIFI/BT), 2MB flash
Datasheet
100Expected 21/7/2027
Min.: 1
Mult.: 1
: 500

2.4 GHz 6 dBm, 13 dBm, 14 dBm, 15 dBm, 16 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 20 mm x 18 mm x 2.6 mm Bluetooth 5.2 Wi-Fi 4 Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C
Datasheet
100Expected 16/12/2026
Min.: 1
Mult.: 1
: 1,000
2.4 GHz, 5 GHz 3.1 V 3.6 V' - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.2 Wi-Fi 6 Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6 (dual band 2.4/5GHz) & Bluetooth 5.4 (Bluetooth LE Audio and BLE Long Range), SDI 3.0 interface, 1x antenna, -40 C to +85 C
Datasheet
100Expected 14/8/2026
Min.: 1
Mult.: 1
: 1,000
2.4 GHz, 5 GHz UART 3 V 4.8 V - 40 C + 85 C 12 mm x 12 mm x 1.55 mm Bluetooth 5.4 WiFi 6 Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C
Datasheet
100Expected 11/9/2026
Min.: 1
Mult.: 1
: 500
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Multiprotocol Modules NXP platform, SDIO Interface
Datasheet
100Expected 4/12/2026
Min.: 1
Mult.: 1
: 1,000
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C 12 mm x 12 mm x 2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datasheet
100Expected 28/8/2026
Min.: 1
Mult.: 1
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel, Cut Tape
Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datasheet
Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
DFRobot Multiprotocol Modules Gravity: CAT1 SIM7600G Global 4G Communication and GNSS Positioning Module (10Mbps/5Mbps) Non-Stocked Lead-Time 4 Weeks
Min.: 1
Mult.: 1

1.9 GHz 5 V 12 V - 40 C + 85 C 60 mm x 52 mm GPS, BD, GLONASS Bulk
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, Integrated Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, No Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, Integrated Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 700
Mult.: 1

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi