Router Switch & Network Applications

Bergquist Company Router Switch and Network Applications include phase change materials and thermally conductive adhesives designed to dissipate heat away from thermally sensitive components. The utilization of advanced materials in server motherboards and line cards for routers and switches offers benefits such as scale and cost reduction. One small uptick in performance, repeated thousands of times, provides a notable impact on router and switch performance. Thermal products from Bergquist Company help components function properly for optimal operation.

Results: 210
Select Image Part # Mfr. Description Datasheet Availability Pricing (SGD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Type Package/Case Material Thermal Conductivity Breakdown Voltage Color Minimum Operating Temperature Maximum Operating Temperature Length Width Thickness Tensile Strength Flammability Rating Series Packaging
Bergquist Company 2682556
Bergquist Company Thermal Interface Products Liqui-Bond EA 1805 Conductive, 2-Part, Liquid Epoxy Adhesive Drop Dispatch Lead Time 8 Weeks
Min.: 1
Mult.: 1

EA 1805 / TLB EA1800
Bergquist Company 2746202
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Drop Dispatch Lead Time 8 Weeks
Min.: 13
Mult.: 1

4000 / TGF 4000
Bergquist Company 2763082
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Drop Dispatch Lead Time 8 Weeks
Min.: 50
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2796659
Bergquist Company Thermal Interface Products Conductive Gel Interface for Data/Telecom, 10 W/m-K, 1 Gallon Pail, Liqui-Form Drop Dispatch Lead Time 8 Weeks
Min.: 25
Mult.: 1

TLF 10000
Bergquist Company 2166562
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 1500 / 1500 Drop Dispatch Lead Time 16 Weeks
Min.: 1,091
Mult.: 1

1500 / TGF 1500
Bergquist Company 2191820
Bergquist Company Thermal Interface Products Gap Filler (2-Part), No Spacer Beads, Pot Life=60m, 3.6 W/m-K, Dual Cartridge Drop Dispatch Lead Time 16 Weeks
Min.: 16
Mult.: 1

3500S35 / TGF 3600
Bergquist Company 2194283
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 1500 / 1500 Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

1500 / TGF 1500
Bergquist Company 2196643
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 4000 / 4000 Drop Dispatch Lead Time 16 Weeks
Min.: 4
Mult.: 1

4000 / TGF 4000
Bergquist Company 2360801
Bergquist Company Thermal Interface Products Gap Filler (2-Part), No Spacer Beads, Pot Life=60m, 3.6 W/m-K, Dual Cartridge Drop Dispatch Lead Time 16 Weeks
Min.: 19
Mult.: 1

3500S35 / TGF 3600
Bergquist Company 2456488
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Tube, Gap Filler TGF 3500LVO / 3500LV Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2478317
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2763109
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2763110
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 3041247
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

TGP 10000ULM
Bergquist Company 3041248
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

TGP 10000ULM
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.008" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.203 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.010" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.254 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.012" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 3.07 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 1 Gallon Pail, 6 W/m-K, Liqui-Form Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM, L8INW16INH0.1 Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 2.54 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Material, 150CC, 3.5 W/m-K, Liqui-Form Non-Stocked Lead-Time 16 Weeks
Min.: 6
Mult.: 1
Thermal Interface Materials Liquid Form 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 1 Gallon, 6.0 W/m-K, Liqui-Form TLF 6000HG Non-Stocked Lead-Time 13 Weeks
Min.: 1
Mult.: 1
Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 6 W/m-K Gray - 60 C + 200 C 90 psi UL 94 V-0 TLF 6000HG
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM Non-Stocked Lead-Time 19 Weeks
Min.: 438
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 1.016 mm 4 psi UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 180ml Cartridge, 6 W/m-K, Liqui-Form
Non-Stocked Lead-Time 16 Weeks
Min.: 10
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material TLF 6000HG
Bergquist Company Thermal Interface Products Liquid Gap Filler, 200CC Dual Cartridge, Gap Filler TGF 1500/1500, IDH 2233096 Non-Stocked Lead-Time 16 Weeks
Min.: 11
Mult.: 1

Gap Fillers / Gap Pads / Sheets Liquid Gap Filler Non-standard Silicone Elastomer 1.8 W/m-K Yellow, White - 60 C + 200 C UL 94 V-0 1500 / TGF 1500