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PL-BT-601-50M

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Mouser No:

567-PL-BT-601-50M

Mfr. No:

PL-BT-601-50M

Mfr.:

Wakefield Thermal

Description:

Thermal Interface Products ulTIMiFlux 1 W/mK, Gap-Filler, for BT-01-50M, BT-02-50M, 50ml Dual Cartridge

Datasheet:

PL-BT-601-50M Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Wakefield Thermal PL-BT-601-50M

Shipping Alert:

This product may require additional documentation to export from the United States.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Wakefield Thermal
Product Category:	Thermal Interface Products
Delivery Restrictions:	This product may require additional documentation to export from the United States.
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	Gap Filler Pad
Material:	Silicone Elastomer
Thermal Conductivity:	1 W/m-K
Color:	Gray
Minimum Operating Temperature:	- 60 C
Maximum Operating Temperature:	+ 200 C
Flammability Rating:	UL 94 V-0
Series:	PL-BT
Brand:	Wakefield Thermal
Designed for:	Semiconductors, Thermal Imaging, Militiary, Vehicle Navigation, Communications, Graphics Cards, Memory Modules, LED Lighting, HDTV
Product Type:	Thermal Interface Products
Factory Pack Quantity:	25
Subcategory:	Thermal Management
Tradename:	ulTIMiFlux

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Datasheet

PL-BT-601-50M Datasheet (PDF)

RoHS Certificate (PDF)

Compliance Codes

USHTS:: 3907300000

Origin Classifications

Country of Origin:: United States
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

ulTIMiFlux™ Thermal Interface Material

Wakefield Thermal ulTIMiFlux™ Thermal Material offers high performance, cost-effectiveness, configurability, and custom sizes for thermal system needs. Thermal Interface Material (TIM) is a secondary material installed between the heat sink and the device and is designed to improve the thermal transfer to the heat sink. The Wakefield Thermal line of dielectric phase change thermal materials are intended to fill voids between a device and the heat sink. The ulTIMiFlux material utilizes a polyimide film to act as a thermally conductive carrier to deliver uniform thickness coating of phase-change thermal compound on both sides. These materials are an effective drop-in-place solution that makes an excellent replacement for thermal greases.

PL ulTIMiFlux™ Thermal Gap Filler

Wakefield Thermal ulTIMiFlux™ Thermally Conductive Gap Filler comprises an ultra-soft thermally conductive silicone supplied as a two-component liquid dispensable material. The thixotropic gap filler from Wakefield Thermal is designed to remain where it is dispensed, conform to the surface, and cure in place. This provides thermal protection at thin bond lines with little to no stress on the components during assembly.