THERM-A-GAP® CIP 35 2.5W/m-K Thermal Compound

Parker Chomerics THERM-A-GAP® Cure-in-Place (CIP) 35 Thermal Compound is a two-component dispensable compound with a 2.5W/m-K thermal conductivity. The CIP 35 compound features 55 Shore A hardness and cools electronics without excessive compressive force in sensitive cooling applications. This versatile liquid can be dispensed by hand or robotically and cured into complex geometries to cool multi-height components on a printed circuit board (PCB) without a molded sheet. The series is available in ready-to-use cartridge systems that eliminate the need for weighing, mixing, and degassing. Parker Chomerics THERM-A-GAP CIP 35 Thermal Compound offers a long shelf life with no settling or degradation of the cure.

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Parker Chomerics Thermal Interface Products Thermal Conductive Cure-In-Place Compound, 2-Part, 2.5W/m-K, 45CC Kit
Datasheet
15In Stock
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Silicone Compound, 2 Part 2.5W/m-K Green - 55 C + 200 C UL 94 V-0 CIP35
Parker Chomerics Thermal Interface Products Thermal Conductive Cure-In-Place Compound, 2-Part, 2.5W/m-K, 200CC Kit
Datasheet
12On Order
Min.: 1
Mult.: 1

CIP35