NXP RF System on a Chip - SoC

Results: 123
Select Image Part # Mfr. Description Datasheet Availability Pricing (SGD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Core Operating Frequency Maximum Data Rate Output Power Sensitivity Supply Voltage - Min Supply Voltage - Max Supply Current Receiving Supply Current Transmitting Program Memory Size Minimum Operating Temperature Maximum Operating Temperature Package/Case Packaging
NXP Semiconductors RF System on a Chip - SoC High Performance and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE 5.0 with Built-in NFC option Non-Stocked Lead-Time 16 Weeks
Min.: 2,450
Mult.: 2,450
BLE 5.0, Zigbee ,Thread Tray
NXP Semiconductors RF System on a Chip - SoC High Performance and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE 5.0 with Built-in NFC option Non-Stocked Lead-Time 16 Weeks
Min.: 4,000
Mult.: 4,000
Reel: 4,000
BLE 5.0, Zigbee ,Thread Reel
NXP Semiconductors RF System on a Chip - SoC Secure and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
Reel: 2,000

Bluetooth Reel
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 1,200
Mult.: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 1,200
Mult.: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 1,200
Mult.: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 1,200
Mult.: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC BLE Only KW40_512 Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
Reel: 2,000

BLE 4.2 Wireless Radio ARM Cortex M0+ 2.4 GHz 1 Mbps 3.5 dBm - 95 dBm 900 mV 4.2 V 6.8 mA 6.1 mA 512 kB - 40 C + 105 C QFN-48 Reel
NXP Semiconductors RF System on a Chip - SoC Kinetis W MCU, ARM CM0+ Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

512 kB Tray
NXP Semiconductors RF System on a Chip - SoC Kinetis W 32-bit MCU, Arm Cortex-M0+, 512KB Flash, 64KB SRAM, 48MHz, BLE, 40QFN Non-Stocked Lead-Time 16 Weeks
Min.: 490
Mult.: 490

BLE ARM Cortex M0+ 2.4 GHz 1 Mbps 3.5 dBm - 95 dBm 1.71 V 3.6 V 6.3 mA 5.7 mA 512 kB - 40 C + 105 C QFN-40 Tray
NXP Semiconductors RF System on a Chip - SoC Kinetis W 32-bit MCU, Arm Cortex-M0+, 512KB Flash, 64KB SRAM, 48MHz, BLE, 40QFN Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
Reel: 2,000

BLE ARM Cortex M0+ 2.4 GHz 1 Mbps 3.5 dBm - 95 dBm 1.71 V 3.6 V 6.3 mA 5.7 mA 512 kB - 40 C + 105 C QFN-40 Reel
NXP Semiconductors RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
Reel: 2,000

BLE ARM Cortex M0+ 2.4 GHz 1 Mbps 3.5 dBm - 95 dBm 1.71 V 3.6 V 6.3 mA 5.7 mA 512 kB - 40 C + 105 C QFN-40 Reel
NXP Semiconductors RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
Reel: 2,000

BLE ARM Cortex M0+ 2.4 GHz 1 Mbps 3.5 dBm - 95 dBm 1.71 V 3.6 V 6.3 mA 5.7 mA 512 kB - 40 C + 105 C LQFN-48 Reel
NXP Semiconductors RF System on a Chip - SoC KW37, 48HVQFN Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
Reel: 2,000

Bluetooth 5.0 Reel
NXP Semiconductors RF System on a Chip - SoC KW38, 48HVQFN Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

Bluetooth 5.0 ARM Cortex M0+ 2.4 GHz 2 Mbps 5 dBm - 95.5 dBm 1.71 V 3.6 V 6.3 mA 5.7 mA 512 kB - 40 C + 105 C HVQFN-48 Tray
NXP Semiconductors RF System on a Chip - SoC KW38, 48HVQFN Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
Reel: 2,000

Bluetooth 5.0 Reel
NXP Semiconductors RF System on a Chip - SoC KW39, 48HVQFN Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
Reel: 2,000

Bluetooth 5.0 Reel