32 bit Tray Embedded Solutions

Types of Embedded Solutions

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Select Image Part # Mfr. Description Datasheet Availability Pricing (SGD) Filter the results in the table by unit price based on your quantity. Qty. RoHS
Alliance Memory DRAM SDRAM, 256Mb, 8M X 32, 3.3V, 86 Pin TSOP II, 166 MHz, Industrial Temp - Tray
324Expected 29/5/2026
Min.: 1
Mult.: 1

Alliance Memory DRAM SDRAM, 256Mb, 8M X 32, 3.3V, 90-ball FBGA, 166 MHz, Industrial Temp - Tray
190Expected 29/5/2026
Min.: 1
Mult.: 1

ISSI DRAM 256M, 3.3V, SDRAM, 8Mx32, 143Mhz, 86 pin TSOP II RoHS
216On Order
Min.: 1
Mult.: 1

Intelligent Memory DRAM LPDDR4x 24Gb 768Mx32 2133MHz FBGA200 -20C to 85C Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

Intelligent Memory DRAM SDRAM, 64Mb, 3.3V, 2Mx32, 166MHz (166Mbps), -40C to +85C, FBGA-54 Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

Intelligent Memory DRAM LPDDR4x 8Gb 256Mx32 2133MHz FBGA200 -20C to 85C Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

Intelligent Memory DRAM LPDDR4x 24Gb 768Mx32 2133MHz FBGA200 -40C to 85C Non-Stocked Lead-Time 10 Weeks
Min.: 120
Mult.: 120

Kingston DRAM 32Gb 200 ball LPDDR4 3733MHz -25c to 85c Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1
Max.: 20

Kingston DRAM 32Gb 200 ball LPDDR4 3733MHz Lead-Time 24 Weeks
Min.: 1
Mult.: 1
Max.: 20

Kingston DRAM 16Gb 200 ball LPDDR4 3733MHz Lead-Time 24 Weeks
Min.: 1
Mult.: 1
Max.: 20

Kingston DRAM 16Gb 200 ball LPDDR4 3733MHz Lead-Time 24 Weeks
Min.: 1
Mult.: 1
Max.: 20

Intelligent Memory DRAM ECC LPDDR4, 4Gb, 1.1V, 128Mx32, 1600MHz (3200Mbps), -40C to +95C, FBGA-200 Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

Intelligent Memory DRAM ECC LPDDR4, 8Gb, 1.1V, 256Mx32, 1600MHz (3200Mbps), -40C to +95C, FBGA-200 Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

Infineon Technologies Development Boards & Kits - Wireless CYW943907AEVAL1F EVAL KIT Non-Stocked Lead-Time 6 Weeks

Infineon Technologies S80KS2564GACHB040
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 260
Mult.: 260

Infineon Technologies CY14B116S-BZ35XI
Infineon Technologies NVRAM NVSRAM Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

ISSI DRAM 512M, 2.5V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 8 Weeks
Min.: 240
Mult.: 240

ISSI DRAM 512M, 3.3V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 8 Weeks
Min.: 240
Mult.: 240

ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 40 Weeks
Min.: 136
Mult.: 136

ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA(10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 40 Weeks
Min.: 136
Mult.: 136

ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked
Min.: 2,500
Mult.: 2,500

ISSI DRAM 512M, 2.5V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, IT Non-Stocked Lead-Time 16 Weeks
Min.: 240
Mult.: 240

ISSI DRAM 256M, 3.3V, Mobile SDRAM, 8Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, IT Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

ISSI DRAM 256M, 1.8V, 133Mhz 8Mx32 Mobile SDR Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

ISSI DRAM Automotive (-40 to +105C), 512M, 1.8V, Mobile DDR, 16Mx32, 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 24 Weeks
Min.: 240
Mult.: 240