HD Express® Interconnect System

Amphenol TCS HD Express® Interconnect System is a high-performance, high-density backplane solution designed to meet PCIe Generation 6 mechanical and electrical requirements for 85Ω impedance systems. Engineered with a single-wafer design, this system enables easy system scaling and offers a competitive cost structure. All press-fit pins ensure reliable board terminations, making the Amphenol TCS HD Express Interconnect System ideal for servers, storage, and high-performing applications.

Results: 4
Select Image Part # Mfr. Description Datasheet Availability Pricing (SGD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Number of Rows Pitch Termination Style Packaging
Amphenol TCS High Speed/Modular Connectors HD Express Backplane 4Pr, 4Pos
171Expected 7/5/2026
Min.: 1
Mult.: 1

Backplane Connector 32 Position 4 Row 2 mm Press-Fit Tray
Amphenol TCS High Speed/Modular Connectors HD Express Backplane 4Pr, 16Pos
54Expected 7/5/2026
Min.: 1
Mult.: 1

Backplane Connector 128 Position 4 Row 2 mm Press-Fit Tray
Amphenol TCS High Speed/Modular Connectors HD Express Daughter Card 4Pr, 4Pos
120Expected 7/5/2026
Min.: 1
Mult.: 1

Daughter Card Module 32 Position 4 Row 2 mm Press-Fit Tray
Amphenol TCS High Speed/Modular Connectors HD Express Daughter Card 4Pr, 16Pos
40Expected 7/5/2026
Min.: 1
Mult.: 1

Daughter Card Module 128 Position 4 Row 2 mm Press-Fit Tray