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F3L200R07W2S5FB11BOMA1

Name: Infineon F3L200R07W2S5FB11BOMA1
Brand: Infineon Technologies
SKU: 726-F3L20R07W2S5FB11
Price: 114.23 SGD
Availability: OutOfStock

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Mouser No:

726-F3L20R07W2S5FB11

Mfr. No:

F3L200R07W2S5FB11BOMA1

Mfr.:

Infineon Technologies

Description:

IGBT Modules 650 V, 200 A 3-level IGBT module

Datasheet:

F3L200R07W2S5FB11BOMA1 Datasheet (PDF)

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	IGBT Modules
RoHS:
Product:	SiC IGBT Modules
Configuration:	3-Phase Inverter
Collector- Emitter Voltage VCEO Max:	650 V
Collector-Emitter Saturation Voltage:	1.17 V
Continuous Collector Current at 25 C:	200 A
Gate-Emitter Leakage Current:	100 nA
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 150 C
Technology:	Si
Packaging:	Tray
Brand:	Infineon Technologies
Product Type:	IGBT Modules
Series:	Trenchstop IGBT5
Factory Pack Quantity:	15
Subcategory:	Discrete and Power Modules
Tradename:	EasyPACK
Part # Aliases:	F3L200R07W2S5F_B11 SP003597026

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Datasheet

F3L200R07W2S5FB11BOMA1 Datasheet (PDF)

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Compliance Codes

CNHTS:: 8504409100
USHTS:: 8541290065
ECCN:: EAR99

Origin Classifications

Country of Origin:: Germany
Assembly Country of Origin:: China
Country of Diffusion:: Germany

The country is subject to change at the time of shipment.

EasyPACK™ 2B IGBT Power Modules

Infineon Technologies EasyPACK™ 2B IGBT Power Modules are a scalable power module solution with a flexible pin grid system perfect for customizing layout and pinout. The packages do not have a base plate, enabling use in various applications. In PIM or Six-Pack configurations, the Infineon EasyPACK 2B IGBT power modules cover the full power range from 20A to 200A at 600V/650V/1200V. These modules also have a power dissipation range from 20mW to 600W and operate from -40°C up to +150°C or +175°C.

F3L200R07W2S5FP EasyPACK™ IGBT Modules

Infineon Technologies F3L200R07W2S5FP EasyPACK™ IGBT Modules feature up to 650V increased blocking voltage capability and employ CoolSiC™ Schottky diode (gen5). These devices are based on TRENCHSTOP™ IGBT5 and PressFIT contact technology. The F3L200R07W2S5FP IGBT modules provide strongly reduced switching losses and an Al₂O₃ substrate with low thermal resistance. These modules come with a compact design comprising rugged mounting due to integrated mounting clamps and pre-applied thermal interface material. The F3L200R07W2S5FP IGBT modules are ideal for motor drives, solar applications, 3-level applications, and UPS systems.

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