FS75R17W2E4PB11BPSA1

Infineon Technologies
726-FS75R17W2E4PB11B
FS75R17W2E4PB11BPSA1

Mfr.:

Description:
IGBT Modules 1700 V, 75 A sixpack IGBT module

Datasheet:
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Learn more about Infineon Technologies FS75R17W2E4PB11BPSA1

Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
35
Expected 24/7/2026
Factory Lead Time:
18
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (SGD)

Qty. Unit Price
Ext. Price
$83.82 $83.82
$67.61 $676.10

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: IGBT Modules
RoHS:  
Tray
Brand: Infineon Technologies
Product Type: IGBT Modules
Series: EasyPACK 2B
Factory Pack Quantity: 18
Subcategory: IGBTs
Technology: Si
Tradename: EasyPACK
Part # Aliases: FS75R17W2E4P_B11 SP005629666
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Attributes selected: 0

Datasheet

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Compliance Codes
CNHTS:
8504409100
CAHTS:
8541210000
USHTS:
8541210095
JPHTS:
854121000
TARIC:
8541210000
MXHTS:
8541210100
ECCN:
EAR99
Origin Classifications
Country of Origin:
Austria
Assembly Country of Origin:
Germany
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

EasyPACK™ 2B IGBT Power Modules

Infineon Technologies EasyPACK™ 2B IGBT Power Modules are a scalable power module solution with a flexible pin grid system perfect for customizing layout and pinout. The packages do not have a base plate, enabling use in various applications. In PIM or Six-Pack configurations, the Infineon EasyPACK 2B IGBT power modules cover the full power range from 20A to 200A at 600V/650V/1200V. These modules also have a power dissipation range from 20mW to 600W and operate from -40°C up to +150°C or +175°C.

FS75R17W2E4P_B11 EasyPACK™ Module

Infineon Technologies FS75R17W2E4P_B11 EasyPACK™ Module features a trench/fieldstop IGBT4 and four emitter-controlled diodes with PressFIT/NTC/TIM. The FS75R17W2E4P_B11 offers low switching losses and a low VCE,sat. The device implements PressFIT contact technology and a rugged mounting design via integrated mounting clamps.

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