LPS33KTR

STMicroelectronics
511-LPS33KTR
LPS33KTR

Mfr.:

Description:
Board Mount Pressure Sensors MEMS pressure sensor: 300-1200 hPa absolute digital output barometer with potted
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In Stock: 1,076

Stock:
1,076 Can Dispatch Immediately
Factory Lead Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2500)

Pricing (SGD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
$5.71 $5.71
$5.12 $25.60
$4.89 $48.90
$4.63 $115.75
$4.45 $222.50
$4.28 $428.00
$3.95 $1,975.00
$3.82 $3,820.00
Full Reel (Order in multiples of 2500)
$3.64 $9,100.00
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Product Attribute Attribute Value Select Attribute
STMicroelectronics
Product Category: Board Mount Pressure Sensors
RoHS:  
Absolute
26 kPa to 126 kPa
100 Pa
Digital
SMD/SMT
I2C, SPI
1.7 V to 3.6 V
No Port
24 bit
3.3 mm x 3.3 mm x 2.9 mm
- 40 C
+ 85 C
Reel
Cut Tape
MouseReel
Brand: STMicroelectronics
Moisture Sensitive: Yes
Product Type: Board Mount Pressure Sensors
Factory Pack Quantity: 2500
Subcategory: Sensors
Supply Voltage - Max: 3.6 V
Supply Voltage - Min: 1.7 V
Part # Aliases: LPS33K
Unit Weight: 1.430 g
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Attributes selected: 0

CNHTS:
8542391090
USHTS:
8542390090
TARIC:
9026208090
ECCN:
EAR99

LPS33K MEMS Pressure Sensor

STMicroelectronics LPS33K MEMS Pressure Sensor combines a sensing element based on a piezoresistive Wheatstone bridge approach with an I2C interface in a single compact package. The sensing element detects absolute pressure and consists of a suspended silicon membrane. When pressure is applied, the membrane deflection induces an imbalance in the Wheatstone bridge, and the output signal is converted by the IC interface. The LPS33K features a data-ready signal that indicates when a new set of measured pressure and temperature data is available, simplifying data synchronization in the digital system that uses the device. STMicroelectronics LPS33K MEMS Pressure Sensor is available in a ceramic LGA package with a metal lid. The package is holed to allow external pressure to reach the sensing element, while the gel inside the IC protects the electrical components from harsh environments.

MEMS Pressure Sensors

STMicroelectronics MEMS Pressure Sensors use innovative MEMS technology to provide extremely high-pressure resolution, in ultra-compact and thin packages. The devices are designed using ST's VENSENS technology, allowing the fabrication of pressure sensors on a monolithic silicon chip. This eliminates wafer-to-wafer bonding and maximizes reliability.

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