TRAVEO™ T2G Cluster

Infineon Technologies TRAVEO™ T2G Cluster MCUs are designed to offer extensive scalability and high performance for automotive applications. These MCUs are fortified with up to two Arm® Cortex®-M7 cores, each clocked at up to 320MHz, delivering a powerful 1500 DMIPS. They also feature impressive memory capacities, with up to 6MB of flash memory and 4MB of VRAM, ensuring ample storage and efficient data handling. Additionally, the TRAVEO™ T2G Cluster comes equipped with a 2.5D graphics engine, enabling advanced graphical displays and enhancing the overall user experience in automotive environments. High processing power, substantial memory, and advanced graphics capabilities make the TRAVEO T2G Cluster a robust solution for modern automotive systems.

Results: 78
Select Image Part # Mfr. Description Datasheet Availability Pricing (SGD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Mounting Style Package/Case Core Program Memory Size Data Bus Width ADC Resolution Maximum Clock Frequency Number of I/Os Data RAM Size Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Packaging
Infineon Technologies ARM Microcontrollers - MCU TRAVEO-2 CLUST.2.5DGRAPH Non-Stocked Lead-Time 26 Weeks
Min.: 400
Mult.: 400

CYT3DL SMD/SMT TEQFP-216 ARM Cortex M0+, ARM Cortex M7 8.19 MB 32 bit 12 bit 100 MHz, 350 MHz 148 I/O 1 MB 2.7 V 5.5 V - 40 C + 105 C Tray
Infineon Technologies ARM Microcontrollers - MCU TRAVEO-2 CLUST.2.5DGRAPH Non-Stocked Lead-Time 26 Weeks
Min.: 960
Mult.: 960

CYT3DL SMD/SMT BGA-272 ARM Cortex M0+, ARM Cortex M7 8.19 MB 32 bit 12 bit 100 MHz, 350 MHz 135 I/O 1 MB 2.7 V 5.5 V - 40 C + 105 C Tray
Infineon Technologies ARM Microcontrollers - MCU TRAVEO-2 CLUST.2.5DGRAPH Non-Stocked Lead-Time 26 Weeks
Min.: 960
Mult.: 960

CYT3DL SMD/SMT BGA-272 ARM Cortex M0+, ARM Cortex M7 8.19 MB 32 bit 12 bit 100 MHz, 350 MHz 135 I/O 1 MB 2.7 V 5.5 V - 40 C + 105 C Tray