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CMX7164Q1

Name: CML Micro CMX7164Q1
Brand: CML Micro
SKU: 226-CMX7164Q1
Price: 36.65 SGD
Availability: InStock

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Mouser No:

226-CMX7164Q1

Mfr. No:

CMX7164Q1

Mfr.:

CML Micro

Description:

Telecom Interface ICs Function Images Supporting 4/16/32/64 QAM, 2/4/8/16 FSK, GMSK/GFSK, V.23

Datasheet:

CMX7164Q1 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about CML Micro CMX7164Q1

In Stock: 26

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Pricing (SGD)

Qty.	Unit Price	Ext. Price
	$36.65	$36.65
	$35.45	$709.00
	$31.89	$3,189.00
	$30.30	$15,150.00
1,000	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	CML Micro
Product Category:	Telecom Interface ICs
RoHS:
Product:	Modems
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Mounting Style:	SMD/SMT
Package/Case:	VQFN-64
Packaging:	Tray
Brand:	CML Micro
Interface Type:	Serial
Moisture Sensitive:	Yes
Operating Supply Voltage:	3.3 V
Pd - Power Dissipation:	3.5 W
Product Type:	Telecom Interface ICs
Series:	CMX7164
Factory Pack Quantity:	20
Subcategory:	Interface ICs
Type:	Modulator
Unit Weight:	2.662 g

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Datasheet

CMX7164Q1 Datasheet (PDF)

RoHS 3 Compliance Statement (PDF)

USHTS:: 8542390090
TARIC:: 8542399000
ECCN:: 5A991.b.7.c

Wireless Packet Data Modems

CML Microcircuits Wireless Packet Data Modems address various communications and control applications, offering operation to custom, free format, and packet data systems. These modems operate within a -40°C to +85°C temperature range and offer Serial, SPI, or UART interface types.

CMX7164 Multi Mode Wireless Data Modems

CML Micro CMX7164 Multi-Mode Wireless Data Modems are half-duplex devices supporting 4/16/32/64 QAM, 2/4/8/16 FSK, GMSK/GFSK, and V.23 modes in multiple channel spacings under host control. The CMX7164 includes an integrated analog interface that supports direct connection to zero IF I/Q radio transceivers with few external components; no external codecs are required. The C-BUS/SPI master interface expands host C-BUS/SPI ports to control external devices. The CMX7164 utilizes FirmASIC® component technology. A Function Image™ data file configures on-chip sub-systems and defines the device’s function and feature set.