AMM-2738-2-B

Name: PUI Audio AMM-2738-2-B
Brand: PUI Audio
SKU: 665-AMM-2738-2-B
Price: 3.5 SGD
Availability: InStock

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Mouser No:

665-AMM-2738-2-B

Mfr. No:

AMM-2738-2-B

Mfr.:

PUI Audio

Description:

MEMS Microphones MICROPHONE -38DB 2.7VDC

Datasheet:

AMM-2738-2-B Datasheet (PDF)

ECAD Model:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	PUI Audio
Product Category:	MEMS Microphones
RoHS:
Sensitivity:	- 38 dB
SNR - Signal to Noise Ratio:	65 dB
Impedance:	300 Ohms
Frequency Range:	20 Hz to 20 kHz
Operating Supply Current:	150 uA
Operating Supply Voltage:	2.7 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Output Type:	Analog
Length:	2.75 mm
Width:	1.85 mm
Depth:	0.9 mm
Packaging:	Reel
Packaging:	Cut Tape
Brand:	PUI Audio
Dimensions:	2.75 mm x 0.9 mm
Directional Properties:	Omnidirectional
Mounting Style:	SMD/SMT
Package/Case:	SMD-3
Product Type:	MEMS Microphones
Shape:	Rectangular
Sound Pressure Level:	160 dB
Factory Pack Quantity:	1250
Subcategory:	Microphones
Supply Voltage - Max:	2.7 V
Supply Voltage - Min:	2.4 V
Termination Style:	SMD/SMT
Type:	Analog MEMS

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Datasheet

AMM-2738-2-B Datasheet (PDF)

Models

AMM-2738-2-B Symbol & Footprint by SnapMagic

Compliance Codes

CNHTS:: 8542391000
CAHTS:: 8518100000
USHTS:: 8518108030
JPHTS:: 851810000
TARIC:: 8518100090
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

MEMS Microphones

PUI Audio MEMS Microphones feature a specialised pre-amplification ASIC that provides high sensitivity and high SNR output from a capacitive audio sensor, contained within a small footprint. These high-performance microphones feature low distortion and high acoustic overload points, resulting in high dynamic range performance. The MEMS microphones offer competitive advantages over most microphones in the market, including ultra-low current consumption. These microphones are housed and packaged for surface mounting and high-temperature reflow assemblies. Key applications include security monitoring devices (breaking-glass detection), industrial devices (machine monitoring for predictive maintenance, in-cabin operator safety), microphone arrays and consumer devices (smart IoT).