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EOS3FF512-PDN64

Name: QuickLogic EOS3FF512-PDN64
Brand: QuickLogic
SKU: 392-EOS3FF512PDN64
Price: 13.21 SGD
Availability: InStock

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Mouser No:

392-EOS3FF512PDN64

Mfr. No:

EOS3FF512-PDN64

Mfr.:

QuickLogic

Description:

SoC FPGA EOS S3 Ultra Low Power MCU + eFPGA

Datasheet:

EOS3FF512-PDN64 Datasheet (PDF)

More Information

Learn more about QuickLogic EOS3FF512-PDN64

In Stock: 961

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Pricing (SGD)

Qty.	Unit Price	Ext. Price
	$13.21	$13.21
	$9.90	$99.00
	$9.44	$236.00
	$8.20	$820.00
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	$6.30	$5,103.00
4,050	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	QuickLogic
Product Category:	SoC FPGA
RoHS:
Mounting Style:	SMD/SMT
Package/Case:	BGA-64
Core:	ARM Cortex M4-F
Maximum Clock Frequency:	80 MHz
Program Memory Size:	512 kB
Number of Logic Elements:	2400 LE
Number of I/Os:	46 I/O
Operating Supply Voltage:	1.1 V
Minimum Operating Temperature:	- 20 C
Maximum Operating Temperature:	+ 85 C
Brand:	QuickLogic
Embedded Block RAM - EBR:	512 kB
Moisture Sensitive:	Yes
Operating Supply Current:	147 uA
Series:	EOS
Factory Pack Quantity:	810
Subcategory:	SOC - Systems on a Chip
Tradename:	EOS S3
Unit Weight:	19.500 mg

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Datasheet

EOS3FF512-PDN64 Datasheet (PDF)

Compliance Codes

USHTS:: 8542310060
ECCN:: 3A991.a.2

Origin Classifications

Country of Origin:: Philippines
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

EOS™ S3 MCU + eFPGA SoCs

QuickLogic EOS™ S3 MCU + eFPGA SoCs are multi-core, ultra-low power sensor-processing Systems-on-a-Chip designed for mobile market applications such as smartphones, wearables, and Internet of Things (IoT) devices. The core of the EOS S3 SoC platform is the proprietary µDSP-like Flexible Fusion Engine (FFE). To complement the FFE, the EOS S3 SoCs also include an Arm® Cortex®-M4 subsystem that enables higher level, general-purpose processing. This multi-core approach, along with multiple power islands, allows the EOS S3 SoCs to process sensor data and run algorithms in the most processing and power-efficient manner possible.