MGM111A256V2

Silicon Labs
634-MGM111A256V2
MGM111A256V2

Mfr.:

Description:
Networking Modules EFR32MG1 Series 1 ARM Cortex-M4 256 kB flash, 32 kB RAM module

Lifecycle:
NRND:
Not recommended for new designs.
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 93

Stock:
93 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (SGD)

Qty. Unit Price
Ext. Price
$25.40 $25.40
$20.98 $209.80
$20.96 $1,048.00
$19.35 $1,935.00
$18.24 $3,648.00
$17.76 $8,880.00
1,000 Quote

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Multiprotocol Modules Mighty Gecko ARM Cortex-M4 512 kB flash, 64 kB RAM module

Product Attribute Attribute Value Select Attribute
Silicon Labs
Product Category: Networking Modules
RoHS:  
EFR32
MGM111
Mesh Networks
ARM Cortex M4
GPIO, I2C, LEUART, USART
250 kb/s
40 MHz, 2.4 GHz
1.85 V
3.8 V
- 40 C
+ 85 C
Cut Tape
Brand: Silicon Labs
Moisture Sensitive: Yes
Product Type: Networking Modules
Factory Pack Quantity: 100
Subcategory: Ethernet & Communication Modules
Unit Weight: 1.755 g
Products found:
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Attributes selected: 0

CAHTS:
8542310000
USHTS:
8517620090
JPHTS:
851762090
TARIC:
8517620000
MXHTS:
8542310302
ECCN:
5A992.C

Mighty Gecko Wireless Mesh Modules

Silicon Labs Mighty Gecko Wireless Mesh Modules are based on the EFR32MG1 Mighty Gecko System on Chip (SoC). Mighty Gecko Mesh Modules are fully certified and integrate all of the components (crystals, RF passives, and antenna) required for a system-level implementation of Zigbee and Thread mesh networks.

MGM111 Mighty Gecko Wireless Mesh Modules

Silicon Labs MGM111 Mighty Gecko Modules are fully-integrated, pre-certified ZigBee and Thread Mesh Networking Modules, enabling rapid development of mesh networking solutions. Based on the Silicon Labs EFR32 Mighty Gecko SoC, these modules combine an energy-efficient, multi-protocol wireless SoC with a proven RF/antenna design, and industry-leading wireless software stacks. This integration accelerates time-to-market and saves months of engineering effort and development costs.