76020-3010

Name: Molex 76020-3010
Brand: Molex
SKU: 538-76020-3010
Price: 56.63 SGD
Availability: InStock

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Mouser No:

538-76020-3010

Mfr. No:

76020-3010

Mfr.:

Molex

Description:

High Speed/Modular Connectors i-trac 7row dc sig m w dc sig mod left sn

Datasheet:

76020-3010 Datasheet

ECAD Model:

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In Stock: 620

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Pricing (SGD)

Qty.	Unit Price	Ext. Price
	$56.63	$56.63
	$50.83	$508.30
	$46.91	$1,172.75
	$46.16	$2,769.60
	$44.70	$5,364.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Receptacles
Number of Positions:	140 Position
Number of Rows:	7 Row
Pitch:	3.7 mm
Termination Style:	Solder Pin
Contact Plating:	Gold
Series:	76020
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Current Rating:	1 A
Housing Material:	Thermoplastic (TP)
Maximum Operating Temperature:	+ 80 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	60
Subcategory:	Backplane Connectors
Tradename:	GbX I-Trac
Voltage Rating:	120 VAC/DC
Part # Aliases:	0760203010
Unit Weight:	18.170 g

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Datasheet

76020-3010 Datasheet

Models

PCN

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

GbX I-Trac Backplane Connector System

The GbX I-Trac Vertical Header Backplane Connector System achieves superior impedance control and 12.5Gbps data rates in high-bandwidth applications. The connectors feature a unique open pin-field design, offering flexibility to assign high-speed differential pairs, low-speed signals, and power/ground contacts anywhere within the pin field.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.