TD60N16SOF

Infineon Technologies
641-TD60N16SOF
TD60N16SOF

Mfr.:

Description:
Discrete Semiconductor Modules 20mm Solder Bond Thyristor/Diode

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In Stock: 5

Stock:
5 Can Dispatch Immediately
Factory Lead Time:
30 Weeks Estimated factory production time for quantities greater than shown.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (SGD)

Qty. Unit Price
Ext. Price
$42.56 $42.56
$35.57 $426.84
$31.09 $3,357.72

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: Discrete Semiconductor Modules
RoHS:  
Thyristor-Diode Modules
Thyristor / Diode
Si
Screw Mount
- 40 C
+ 125 C
Tray
Brand: Infineon Technologies
Gate Trigger Current - Igt: 100 mA
Holding Current Ih Max: 250 mA
Product Type: Discrete Semiconductor Modules
Factory Pack Quantity: 12
Subcategory: Discrete and Power Modules
Part # Aliases: SP001272784 TD60N16SOFHPSA1
Unit Weight: 75 g
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CNHTS:
8504409100
CAHTS:
8541300000
USHTS:
8541300080
JPHTS:
854130000
KRHTS:
8541109000
TARIC:
8541300000
MXHTS:
8541100101
ECCN:
EAR99

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.