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10169063-5002100LF

Name: Amphenol 10169063-5002100LF
Brand: Amphenol FCI
SKU: 649-101690635002100L
Price: 59.19 SGD
Availability: InStock

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Mouser No:

649-101690635002100L

Mfr. No:

10169063-5002100LF

Mfr.:

Amphenol FCI

Description:

Board to Board & Mezzanine Connectors DensiStak Header H2 .8mm x 1.25mm 550Pos 11 x 50 3u 8mm STK HT

Datasheet:

10169063-5002100LF Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Amphenol FCI 10169063-5002100LF

In Stock: 520

Stock:: 520 Can Dispatch Immediately

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Factory Lead Time:: 8 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (SGD)

Qty.	Unit Price	Ext. Price
	$59.19	$59.19
	$50.32	$503.20
	$48.69	$1,217.25
	$48.44	$2,422.00
	$47.65	$4,765.00
Full Reel (Order in multiples of 260)
	$45.47	$11,822.20

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Amphenol
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Packaging:	Reel
Packaging:	Cut Tape
Brand:	Amphenol FCI
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	260
Subcategory:	Board to Board & Mezzanine Connectors
Tradename:	DensiStak

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Technical Resources

USHTS:: 8536694040
TARIC:: 8536693000
ECCN:: EAR99

DensiStak™ Board-to-Board Connectors

Amphenol FCI DensiStak™ Board-to-Board Connectors are high-density connectors with a dual-beam contact system to ensure reliable performance. The connectors feature an 11-row design with up to 1034 pin positions and an open-pin field design for added flexibility. The DensiStak connectors offer high-speed performance of up to 16Gb/s and meet PCIe^® Gen 4, Ethernet, USB, DP, and MIPI protocols. The Amphenol FCI DensiStak Board-to-Board Connectors are constructed with a UL 94V-0-rated housing material that can withstand harsh environments. The connectors are RoHS and USCAR-2 compliant, ideal for automotive applications, including Advanced Driver Assistance Systems (ADAS). The DensiStak devices are also suitable for servers, data storage, artificial intelligence (AI), industrial, and sensing/instrumentation applications.