61083-142602LF

Amphenol FCI
649-61083-142602LF
61083-142602LF

Mfr.:

Description:
Board to Board & Mezzanine Connectors BERGSTAK HEADER 140

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
6 Weeks Estimated factory production time.
Minimum: 550   Multiples: 550
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (SGD)

Qty. Unit Price
Ext. Price
Full Reel (Order in multiples of 550)
$6.99 $3,844.50

Product Attribute Attribute Value Select Attribute
Amphenol
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Headers
140 Position
0.8 mm (0.031 in)
Solder
800 mA
100 V
- 40 C
+ 125 C
Gold
Brass
Liquid Crystal Polymer (LCP)
BergStak 0.80mm
Reel
Brand: Amphenol FCI
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 550
Subcategory: Board to Board & Mezzanine Connectors
Tradename: Bergstak
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Compliance Codes
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

BergStak® 0.8mm Connectors

Amphenol FCI compact Bergstak® 0.8mm pitch connector series offers an extensive range of stack heights and circuit sizes to support a wide range of mezzanine, board-stacking communications, data, and industrial applications. Amphenol FCI BergStak connectors are available in sizes from 40 to 200 positions in 20-position increments and stack heights from 5mm to 16mm in 1mm increments.

Bergstak® Board-to-Board Connectors

Amphenol FCI Bergstak® Board-to-Board Connectors are designed for industrial, telecom, datacom, automotive, and medical applications. These Bergstak connectors from Amphenol FCI offer micro-pitches from 0.40mm to 0.80mm, connector position options from 10 to 200, and stack height flexibility from 3mm to 20mm. The wide-ranging product line is suited to fit a variety of application requirements.